|
|
| |
|
|
|
|
|
|
 Click to enlarge image |
MAX. PANEL Size : 20 " x 24 "
BASE MATERIAL : FR-4
COPPER : 0.5 oz, 1 oz or 2 oz
THICKNESS : 0.023 " ~ 0.189 "
FINISH : H.A.L(Ni/Au), Immersion Gold, Immersion Silver, Immersion Tin
SOLDER RESIST : PSR
U.L. GRADE: 94V-0(ML)
MIN. COND.WIDTH : 4 mils (outer) 4 mils (inner)
MIN. COND.SPACE : 4 mils (outer) 4 mils (inner)
MIN. HOLE SIZE : 11.81 mils(outer)
MIN. LAND SIZE : 19.68 mils (outer)
INNER LAYER CLEARANCE : MIN HOLE SIZE + 15.74 mils
|
|
| [ 연락처 정보 ] |
 Company |
(주)아론컴 |
| Address |
인천 서구 석남동 223-571
(우:404-220) 한국 |
| Phone |
82 - 32 - 5844067 |
| Fax |
82 - 32 - 5848184 |
| Homepage |
www.aronpcb.com |
| Contact |
김가영 / 계장 |
|
|
|
| |
 |
| 223-571, Seoknam-dong, Seo-gu, Incheon-city, Korea
Tel No. +82-32-584-4067 Fax No. +82-32-584-8184 Email : jullia@aronpcb.com |
|
|
|
|
